The listing, NC-559-ASM BGA Soldering Tin Cream has ended.
NC-559-ASM BGA lead-free solder paste, easy to use.
Lead-free solder paste had transparent residue and low solder ball rate, possess excellent wetting ability on PCB.
Transparent Residue, No Halogen.
Multi-function: for phone PCB BGA repair, and other electronics welding, soldering.
This type of solder paste composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability.
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Delivers in 4-7 business weeks.
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